Valens Semiconductor Named Honoree in Three CES 2023 Innovation Award Categories

Company’s latest innovations for advancing vehicle safety and mobility to be showcased at LVCC West Hall #W319

HOD HASHARON, Israel, November 28, 2022 – Valens Semiconductor (NYSE: VLN), a premier provider of high-speed connectivity solutions for the automotive and audio-video markets, today announced that it has been named a CES® Innovation Awards Honoree in three categories: Embedded Technologies, Vehicle Tech & Advanced Mobility, and In-Vehicle Entertainment & Safety. These awards demonstrate Valens Semiconductor’s unique and comprehensive set of high-speed connectivity solutions for today and tomorrow’s cars, and for markets requiring machine vision, such as medical and robotics. This year’s CES Innovation Awards program received a record high number of over 2100 submissions.

Embedded Technologies award: Valens Semiconductor’s VA7000 chipset family that addresses various markets requiring advanced machine vision – automotive, medical, robotics, and more was recognized for its long reach, multi-gig sensor connectivity. The VA7000 chipset family offers the automotive industry unprecedented bandwidth, distance, and resilience to Electromagnetic interference (EMI), empowering Advanced Driver-assistance Systems (ADAS) and autonomous applications. The VA7000 will also enable advancements in medical equipment targeted for use in invasive procedures, such as disposable endoscopy, that require affordable long-reach, small footprint, high-resolution video, over flexible wiring with EMI immunity.

Vehicle Tech & Advanced Mobility award: The VA7000 chipset family was also recognized for being the first in the industry to release an A-PHY compliant high-speed long-reach Serializer/Deserializer (SerDes) solution for in-vehicle connectivity. The VA7000 enables faster adoption of software-defined vehicles that require centralized processing, high bandwidth, and error free links with practically zero latency, which are essential for safety applications. The VA7000 chipsets are the only ones on the market with the ability to operate over Unshielded Twisted Pair (UTP) cables at multi-gig link speeds, which leads to savings in total system cost and weight.

In-Vehicle Entertainment & Safety award: The VA6000 chipset family member, VA600R, brings unprecedented life-saving rear-view visibility to the trucking industry. It offers error-free links, for distances of up to 40 meters/~130 feet, providing immunity to EMI, over the existing wiring (jumper cable) of tractor-trailers and as such is applicable for new trucks and for the aftermarket.

“Having been named in three innovation award categories, for our connectivity solutions designed to increase safety in today and tomorrow’s cars, is a great honor,” said Gideon Kedem, SVP and Head of Automotive, at Valens Semiconductor. “As the Automotive industry is undergoing a major transformation, Valens Semiconductor is redefining in-vehicle connectivity by providing a unique and comprehensive set of high-speed connectivity solutions. We are excited to see the strong momentum as automotive OEMs, Tier-1s and Tier-2s, join the growing VA7000 A-PHY ecosystem.”

“At Valens Semiconductor, we are proud to drive innovation and safety of medical procedures with the highest possible medical-grade video image quality, allowing for the most accurate representation of patients’ conditions,” said Gabi Shriki, SVP and head of Audio-video, at Valens Semiconductor.  “An important pillar of our strategy is leveraging our automotive chipsets, for audio-video use, in a variety of industries, such as corporate, education, medical, industrial and more.”

The CES Innovation Awards program, owned and produced by the Consumer Technology Association (CTA)®, is an annual competition honoring outstanding design and engineering in 28 consumer technology product categories. Those with the highest rating receive the “Best of Innovation” distinction. An elite panel of industry expert judges, including members of the media, designers, engineers and more, reviewed submissions based on innovation, engineering and functionality, aesthetic and design.

Join Valens Semiconductor at CES 2023 (LVCC, West Hall, #W319, Jan. 5 – Jan. 7, 2023) to learn more about our latest innovations for advancing vehicle safety and mobility.  Contact us here to schedule a meeting.

About Valens Semiconductor

Valens Semiconductor pushes the boundaries of connectivity by enabling long-reach, high-speed video and data transmission for the Audio-Video and Automotive industries. Valens’ HDBaseT® technology is the leading standard in the Audio-Video market with tens of millions of Valens’ chipsets integrated into thousands of products in a wide range of applications. Valens’ Automotive chipsets are deployed in systems manufactured by leading customers and are on the road in vehicles around the world. Valens is a key enabler of the evolution of ADAS and autonomous driving and its advanced technology is the basis for the MIPI A-PHY standard for high-speed in-vehicle connectivity. For more information, visit https://www.valens.com/.

Forward-Looking Statements

This press release includes “forward-looking statements” within the meaning of the “safe harbor” provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as “estimate,” “plan,” “project,” “forecast,” “intend,” “will,” “expect,” “anticipate,” “believe,” “seek,” “target” or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor’s (“Valens”) management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as, and must not be relied on by any investor as, a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor.

These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effects of health epidemics, such as the recent global COVID-19 pandemic; the impact of the global pandemic caused by COVID-19 on our customers’ budgets and on economic conditions generally, as well as the length, severity of and pace of recovery following the pandemic; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers’ demand; disruptions in relationships with any one of Valens’ key customers; any difficulty selling Valens’ products if customers do not design its products into their product offerings; Valens’ dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to sudden reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; political, economic, governmental and tax consequences associated with our incorporation and location in Israel; and those factors discussed in Valens’ Form 20-F  filed with the SEC on March 2, 2022 under the heading “Risk Factors,” and other documents of Valens filed, or to be filed, with the SEC. If any of these risks materialize or our assumptions prove incorrect, actual results could differ materially from the results implied by these forward-looking statements. There may be additional risks that Valens does not presently know or that Valens currently believes are immaterial that could also cause actual results to differ from those contained in the forward-looking statements. In addition, forward-looking statements reflect Valens’ expectations, plans or forecasts of future events and views as of the date of this press release. Valens anticipates that subsequent events and developments may cause Valens’ assessments to change. However, while Valens may elect to update these forward-looking statements at some point in the future, Valens specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing Valens’ assessment as of any date subsequent to the date of this press release. Accordingly, undue reliance should not be placed upon the forward-looking statements.

Valens Media Contact:

Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com

Valens Investor Contacts:

Daphna Golden
Vice President Investor Relations
Valens Semiconductor Ltd.
investors@valens.com

Moriah Shilton
Financial Profiles, Inc.
US: +1 310-622-8251
Valens@finprofiles.com

SOURCE Valens Semiconductor